GIGABYTE B550M DS3H AC R2
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Sprawdź, jak działa (otwiera się w nowej karcie)Opis produktu
Producer - Gigabyte
Specyfikacja
- Package features / Embeeded battery: No
- Package features / Gross depth (mm): 244.00 mm
- Package features / Gross height (mm): 54.00 mm
- Package features / Gross width (mm): 244.00 mm
- Package features / Packing quantity: 1.00 szt.
- Package features / Palette Qty: 269 szt.
- Package features / Paper/Pasteboard: 190.00 g
- Package features / Plastic (No PET): 10.00 g
- Package features / Tare weight (kg): 0.20 kg
- Package features / Volume (m3): 0.00 m³
- Package features / WEEE tax: CL109:6:2017-04-01
- Technical details / Gross weight: 1.02 kg
- Technical details / Net weight: 0.82 kg
- Technical details / Producer: Gigabyte
- Warranty: 36 miesiąc
Szczegóły produktu
- Marka Gigabyte
- Kod produktu 684258f1ce70ca7471b17701
- Dostępność 10 Przedmioty
- EAN13 4719331869908
- MPN B550M DS3H AC R2
Specyfikacja
- Typ pamięci RAM DDR4
- Wi-Fi Tak
- Bluetooth Tak
- Gniazdo procesora AM4
- Maksymalna pojemność RAM (GB) 128 GB
- Chipset AMD B550
-
Złącza wewnętrzne
24pin ATX zasilanie
4pin wentylator procesora
8pin 12V zasilanie
M.2
Przedni panel audio
Przycisk Q-Flash Plus
SATA III 6Gb/s
System panel (front)
TPM
USB 2.0/1.1
USB 3.2 Gen 1 Type-A
USB C
Zworka Clear CMOS - Liczba slotów RAM (szt.) 4 szt.
- Liczba gniazd M.2 (szt.) 2 szt.
Producent
Producent
Gigabyte Technology Poland Sp. z o.o.
Metalowców 31/3-4 54-156 Wrocław Polska
E-mail: lukasz.moga@gigabyte.com
Osoba odpowiedzialna w UE
GIGA-BYTE TECHNOLOGY B.V.
Steenoven 24 5626DK Eindhoven Netherlands
E-mail: EU.grp@gigabyte.com
Bezpieczeństwo
Informacje o bezpieczeństwie
List of motherboard safety warnings based on the requirements of General Product Safety Regulation (EU) 2023/988 (GPSR): * Risk of electric shock: Make sure the power supply is disconnected before installing or disassembling any components. Do not touch pins, connectors or paths on the board with wet hands or in humid environments. * Short-circuit risk: Be careful that no metal objects come into contact with the plate during installation or use. * Risk of Electrostatic Damage (ESD): Use an antistatic band when working with the motherboard to avoid damage to sensitive components. * Risk of injury: Sharp edges and small elements on the board can pose a risk of injury. Be careful when manipulating. * Fire risk: Incorrect connection of power supply or overheating of components can lead to fire. Make sure all connections are correct and cooling is adequate. * Risk of component damage: Do not use excessive force when installing components to avoid damaging the board or the component itself. * Compatibility: Make sure that all components (processor, RAM, graphics card) are compatible with your motherboard. * Stability: Place the motherboard on a stable, flat surface to prevent mechanical damage. * Overheating: Provide adequate cooling to prevent the motherboard and its components from overheating. Clean radiators and fans regularly. * Kids: Keep the motherboard and small items out of reach of children to avoid the risk of ingestion or other accidents. * Installation: Disconnect the motherboard from power before any interference.